Clinical Psychology

Application review

Consistent with our mission, the Clinical Psychology program at DePaul University strongly encourages applications from students from under-represented ethnic minority groups, students with disabilities, and students who demonstrate a commitment to understanding the societal and systemic/ecological forces that have contributed to current manifestations of inequality for many diverse groups such as for low-income, urban, and ethnically diverse populations and on how these conditions influence mental health, family/community processes, and access to mental health services.

We have decided to eliminate the GRE requirement for admission to our doctoral program. In line with our program aims, we have been conducting holistic review of all applications for many years. This means that we have never set minimum GRE scores required for admission, but we have used the GRE as one piece of our holistic review. We recognize that GRE scores are correlated with ethnicity and sex and that they are unhelpful in predicting the success that students will have in doctoral programs.

We recognize that some applicants may have already taken the GRE and they may still wish for their scores to be submitted for evaluation. We also know that when some applicants submit GRE scores, other applicants may perceive that they also need to submit GRE scores to remain competitive. In order to truly eliminate the use of GRE scores, we do not allow any applicant to submit GRE scores with their admissions materials. The Clinical Psychology program funds its applicants equally and does not have additional admission slots for applicants with high GRE scores. Thus, we do not have a compelling reason to continue the use of the GRE for admission decisions.

Please note that programs at other institutions may continue to use the GRE in their admission processes. You should should review each individual program's admission requirements before applying.

Our holistic review process includes consideration of the following materials: